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| (R) STTH208/U HIGH VOLTAGE ULTRAFAST RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s s 2A 800 V 175 C 1.25 V s s s Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology DO-15 STTH208 DESCRIPTION The STTH208, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. SMB STTH208U ABSOLUTE RATINGS (limiting values) Symbol VRRM V(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS voltage Average forward current Tl = 60C Tl = 100C IFSM Forward surge current t = 8.3 ms =0.5 =0.5 DO-15 SMB DO-15 SMB Tstg Tj Storage temperature range Maximum operating junction temperature Value 800 560 2 2 45 35 - 50 + 175 + 175 C C A Unit V V A January 2003 - Ed: 1 1/5 STTH208/U THERMAL PARAMETERS Symbol Rth (j-l) Junction to lead Parameter L = 10 mm DO-15 SMB Rth (j-a) Junction to ambient L = 10 mm DO-15 Value 40 25 110 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR Parameter Reverse leakage current Tests conditions VR = 800V Tj = 25C Tj = 125C VF Forward voltage drop IF = 2 A Tj = 25C Tj = 150C To evaluate the maximum conduction losses use the following equation : P = 1.05 x IF(AV) + 0.10 x IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A IF = 2 A dIF/dt = 50 A/s VFR = 1.1 x VF max Tj = 25C Tj = 25C Min. Typ. Max. 75 200 9 Unit ns ns V 0.89 Min. Typ. Max. 5 50 1.65 1.25 V Unit A 2/5 STTH208/U Fig. 1: Conduction losses versus average current. P(W) 3.5 3.0 100.0 Fig. 2: Forward voltage drop versus forward current. IFM(A) = 0.1 = 0.05 = 0.2 = 0.5 Tj=150C (maximum values) 2.5 =1 2.0 1.5 10.0 Tj=150C (typical values) Tj=25C (maximum values) 1.0 1.0 0.5 T IF(AV)(A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 =tp/T 2.0 2.2 tp 0.1 2.4 0.00 0.25 0.50 0.75 1.00 1.25 VFM(V) 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10mm) (DO-15). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 Single pulse = 0.2 = 0.1 = 0.5 Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S=1cm2) (SMB). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 = 0.2 = 0.1 = 0.5 T 0.2 0.1 T tp(s) 1.E+01 =tp/T 1.E+02 tp 0.0 1.E+03 1.E-01 Single pulse tp(s) 1.E+00 1.E+01 =tp/T 1.E+02 tp 1.E+03 1.E+00 Fig. 4: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a)(C/W) 110 100 90 80 SMB 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DO-15 Lleads=10mm S(cm) 3/5 STTH208/U PACKAGE MECHANICAL DATA SMB DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L FOOTPRINT (in millimeters) 2.3 1.52 2.75 1.52 4/5 STTH208/U PACKAGE MECHANICAL DATA DO-15 DIMENSIONS C A C REF. Millimeters Min. Max. 6.75 3.53 31 0.88 Inches Min. 0.238 0.116 1.024 0.028 Max. 0.266 0.139 1.220 0.035 A B D B 6.05 2.95 26 0.71 C D Ordering code STTH208 STTH208U STTH208RL s Marking STTH208 U08 STTH208 Package DO-15 SMB DO-15 Weight 0.4 g 0.11 g 0.4 g Base qty 1000 2500 6000 Delivery mode Ammopack Tape & reel Tape & reel Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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